Networking

The NetApp 114-00063 (also listed as 114-00063+A0 or X758-R6 in some references) is an 850W (891W peak) AC power supply unit (PSU) designed for the NetApp FAS3000 series controllers, specifically the FAS3140, FAS3160, and FAS3170 systems (and compatible with some FAS3240 configurations).

This is a rear-mounted, hot-swappable redundant power supply that provides 850W continuous output power (up to 891W peak) to the FAS3140/3160/3170 controller enclosure. It is engineered for high-availability storage systems running ONTAP, supporting dual-controller HA pairs with N+1 redundancy.

The PSU accepts universal AC input (100–240V) and delivers multiple regulated DC rails to the midplane for controllers, drives, fans, and I/O modules. It features an integrated cooling fan with front-to-back airflow (matching the FAS3000 chassis direction) and clear LED status indicators (AC OK, DC OK, Fault).

In typical deployments, the FAS3140/3160/3170 uses two PSUs in a redundant configuration — allowing live replacement of a failed unit without downtime.

0952848-01 Dell Xyratex Compellant 12-Bay HB-1235 SAS Storage Disk Array

12R7021 IBM Bulk Power Regulator for P590 P595

12-00136-100-A JNI FibreStar Dual Port Fibre Channel HBA

The Dell 02TRM4 is an enterprise-class 1.8TB SAS hard disk drive (HDD) in 2.5-inch SFF (Small Form Factor) with a 12 Gbps SAS (SAS-3) interface and 10,000 RPM spindle speed. It is an OEM-branded version of the Toshiba AL14SEB18EQ (or equivalent AL14SEB series), certified and rebranded by Dell for use in PowerEdge servers and Dell EMC storage platforms.

This is a high-performance, tier-1 enterprise SAS HDD optimized for low-latency random I/O, high IOPS, and reliable 24×7 operation in demanding workloads such as databases, virtualization, VDI, OLTP, transactional systems, boot/OS volumes, and primary storage tiers where speed and responsiveness matter more than maximum capacity per drive.

The drive features:

• Dual-port SAS for redundancy and multipathing in high-availability configurations
• 128 MB cache buffer for improved burst and sustained performance
• 512e (512-byte emulation / Advanced Format) sector format for broad OS/RAID compatibility
• Advanced rotational vibration safeguards to maintain stability in dense multi-drive enclosures

In Dell deployments, the 02TRM4 is commonly used as a performance tier drive in PowerEdge servers (especially 13G–15G generations: R630/R640/R730/R740 series) and compatible Dell EMC storage arrays. It is a popular replacement or upgrade drive for systems needing high random IOPS alongside SSD tiers for hybrid performance/cost balance.

Supermicro SuperWorkstation 4U Rackmount Server 747-16 PN: 7047GR-TRF w/ 2x Intel Xeon E5-2640 v2 8-CORE 2GHz | 64GB RAM | 3x 6GB Asus GTX Geforce Titan Black Video Card PN: GTXTITAN-6GD5 | 10-GIGABIT Ethernet Card PN: CX311A

774026-001 3.5" Drive tray Caddy fit HP Apollo 4200 4510 Proliant DL325 ML110 Gen10

This is a dual-port 8Gb Fibre Channel PCIe HBA designed for high-performance SAN connectivity in Oracle servers, storage systems, and workstations. It provides two independent 8 Gbps FC ports for attaching to Fibre Channel switches, storage arrays (e.g., Oracle ZFS Storage, StorageTek tape libraries, or third-party SAN storage), or direct-attach storage.

OEM Base: Emulex LPe12002 (Emulex LightPulse 12002 dual-port 8Gb FC HBA)
Oracle/Sun Branding: Rebranded and certified by Oracle/Sun for use in Sun/Oracle x86 and SPARC servers, Oracle StorageTek tape libraries (SL3000/SL8500), and Oracle engineered systems.

519320-001 HP D2700 Storage Array Controller SAS Enclosure

IBM zEnterprise IBM 11S45D08 Evaporator Assembly, refrigerated Heatsink.

777430-B21 HP Synergy 3820C 10/20GB Converged Network Adapter

The IBM 11S45D346 is the Evaporator Assembly (refrigerated / liquid-cooled heatsink) for high-end IBM zEnterprise systems, primarily the zEnterprise 196 (z196) and zEnterprise 114 (z114).

Product Description

This is a specialized water/liquid-cooled cold plate and evaporator unit that mounts directly onto the high-power Multi-Chip Modules (MCMs) in the Central Electronics Complex (CEC). It uses chilled liquid (facility chilled water or a dedicated cooling loop) to efficiently remove heat from the processors, providing far superior thermal performance compared to traditional air-cooled heatsinks.

In liquid-cooled zEnterprise configurations, multiple evaporator assemblies are used (one per processor book/MCM). The assembly includes:

• Integrated cold plate/evaporator with internal liquid channels
• Quick-connect fittings for the chilled water loop
• Temperature sensors and leak detection circuitry
• Precision mounting hardware and thermal interface material

This component is critical for maintaining proper operating temperatures in dense, high-TDP z196/z114 systems. Failure or leakage can trigger thermal alerts, processor de-configuration, throttling, or protective system shutdown.

Replacement is a major service action that typically requires powering down the CEC and trained IBM service personnel due to the liquid cooling loop.

The IBM 11S45D75 is the Evaporator Assembly (refrigerated / liquid-cooled heatsink) for high-end IBM zEnterprise systems, primarily the zEnterprise 196 (z196) and zEnterprise 114 (z114) in liquid-cooled configurations.

Product Description

This is a specialized liquid-cooled cold plate and evaporator unit that mounts directly onto the high-power Multi-Chip Modules (MCMs) in the Central Electronics Complex (CEC). It uses chilled liquid (typically facility chilled water or a dedicated cooling loop) to efficiently absorb and remove heat from the processors, providing significantly better thermal performance than traditional air-cooled heatsinks.

In liquid-cooled zEnterprise setups, multiple evaporator assemblies are installed (one per processor book/MCM). The assembly includes:

• Integrated cold plate/evaporator with internal liquid channels
• Quick-connect fittings for the chilled water loop
• Temperature sensors and leak detection circuitry
• Precision mounting hardware and thermal interface material

This component is critical for maintaining safe operating temperatures in dense, high-TDP z196/z114 systems. Failure or leakage can trigger thermal alerts, processor de-configuration, throttling, or protective system shutdown.

Replacement is a major service action that usually requires powering down the CEC and trained IBM service personnel due to the liquid cooling loop.

EMC 118033270 350GB SSD PCIe MLC Add-In Card